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Qnity Electronics, Inc.

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Qnity Joins PHLX Semiconductor Sector Index (SOX)

Business Wire · Mon, 21 Sep 2026 16:05:00 -0400

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that it has been added to the PHLX Semiconductor Sector Index (SOX). “Joining the PHLX Semiconductor Sector Index marks another important milestone for Qnity as a public company,” said Jon Kemp, Chief Executive Officer of Qnity. “Our inclusion reflects the scale and relevance of our business across the semiconductor value cha.

Qnity Introduces Stackplane™ CMP Slurry Platform for Advanced Packaging

Business Wire · Mon, 31 Aug 2026 06:30:00 -0400

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP). Stackplane™ slurries support the industry's move toward shrink and stack, where continued transistor scaling is paired with the stacking and integration of multiple chips to delive.

Qnity Electronics Sees AI, Advanced Packaging Fueling Its Next Growth Phase

MarketBeat · Sat, 29 Aug 2026 08:02:05 -0400

Qnity Electronics NYSE: Q Chief Executive Officer Jon Kemp outlined the semiconductor-materials company's strategy, growth drivers and capital-allocation priorities during the Deutsche Bank Technology Conference, emphasizing demand tied to artificial intelligence, advanced packaging and thermal management.

Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions

Business Wire · Tue, 25 Aug 2026 06:30:00 -0400

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced a scalable materials solution platform that brings together metallization, bumping, dielectric, and fine-line patterning technologies to enable next-generation high-density and 3D integrated semiconductor systems. The platform enables AI-driven advanced packaging, where finer interconnects, higher density, and improved manuf.

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